WSJ cited sources inside of Apple’s supply chain that the company is being very aggressive with its build strategies for the new iPhone, and has directed its manufacturers to expect orders totaling 25 million units over the coming months. The report claims that unless Foxconn can improve its yields, Apple will be unable to meet such a lofty goal. Insiders have claimed that the iPhone 5 is both “complicated” and “difficult to assemble”.
The report also rumored that the next iPhone will include new models of a wireless baseband chip developed by Qualcomm, which will be replacing the iPhone 4’s chips which were provided by Infineon. It’s been widely suspected that Apple will be moving to a “world phone” chipset with the next iPhone, enabling use on both GSM and CDMA networks across the globe and simplifying the number of models that Apple needs to develop. The WSJ report didn’t provide any indication if this Qualcomm chip would be “world phone” capable.